MT41K256M16HA-125:E Detailed explanation of pin function specifications and circuit principle instructions

The part number you provided, "MT41K256M16HA-125:E," corresponds to a Micron DRAM chip. Micron Technology is a well-known manufacturer of semiconductor memory products, including DRAM, Flash, and SSDs. Specifically, this model is a DDR4 DRAM module with a capacity of 4GB (256M x 16-bit) in a FBGA (Fine Ball Grid Array) package. The package typically comes in 96-ball FBGA form, and this number can vary depending on specific configurations, but for this part number, it is typically associated with a 96-ball FBGA package.

Pin Function Specifications:

For the detailed pinout of the "MT41K256M16HA-125:E" and its pin functions, please refer to the technical datasheet from Micron. This datasheet will provide an exact list of all the pins, their functions, and any relevant electrical characteristics. Since this part is a complex DRAM device, the full explanation of its pin functions will include critical signal pins, Power , ground, and control pins.

For example, here is a simplified breakdown of the general pin functions for a typical DDR4 memory chip:

VDD (Power Pins): These pins provide the power supply to the DRAM chip. VSS (Ground Pins): Ground pins for proper electrical operation and return paths. DQ (Data Pins): The data pins are used to transmit and receive data between the memory and the system. A0-A15 (Address Pins): These are the address pins used to select a specific memory location. BA0-BA2 (Bank Address Pins): These pins select the bank within the DRAM module. CK, CK# ( Clock Pins): Clock signals used for timing in data transfer. CS# (Chip Select Pin): This pin is used to enable or disable the memory chip. RAS#, CAS#, WE# (Control Pins): These pins control the row, column, and write enable functionality of the memory. ODT (On-Die Termination): These pins are used for terminating the signal lines. RESET#: A reset pin used to initialize the device. CASC# (CAS Latency Select): This pin allows the system to configure the latency of the memory. NC (No Connect Pins): These pins are not connected internally and are not used.

The exact number of pins, their assignments, and the necessary details for the full set of pins will be in the datasheet and user manual. For a 96-ball package, the pins are organized in a grid pattern, and the table would contain 96 entries describing each pin function.

Packaging:

Package Type: 96-ball FBGA (Fine Ball Grid Array) Package Size: 8mm x 8mm (for this specific model) Pin Pitch: 0.8mm

FAQ for "MT41K256M16HA-125:E":

1. What is the part number "MT41K256M16HA-125:E"?

Answer: The part number "MT41K256M16HA-125:E" refers to a 4GB DDR4 DRAM chip manufactured by Micron, featuring a 96-ball FBGA package and operating at a 1.2V supply voltage.

2. What type of memory is "MT41K256M16HA-125:E"?

Answer: The "MT41K256M16HA-125:E" is a DDR4 DRAM chip used in various memory applications, including servers, laptops, and other devices requiring high-speed memory.

3. How many pins does the "MT41K256M16HA-125:E" package have?

Answer: The "MT41K256M16HA-125:E" comes in a 96-ball FBGA package, meaning it has 96 pins for electrical connections.

4. What is the voltage requirement for "MT41K256M16HA-125:E"?

Answer: The "MT41K256M16HA-125:E" operates at a voltage of 1.2V.

5. What is the data rate of the "MT41K256M16HA-125:E"?

Answer: The data rate of the "MT41K256M16HA-125:E" is DDR4, with speeds typically ranging from 2400 MT/s to 3200 MT/s, depending on the specific configuration.

6. What is the package size of "MT41K256M16HA-125:E"?

Answer: The "MT41K256M16HA-125:E" comes in an 8mm x 8mm 96-ball FBGA package.

7. What is the maximum operating temperature for the "MT41K256M16HA-125:E"?

Answer: The operating temperature for this chip typically ranges from 0°C to 85°C (commercial grade), with extended options for industrial temperatures if needed.

8. What is the purpose of the CK and CK# pins in the "MT41K256M16HA-125:E"?

Answer: The CK and CK# pins are the clock signals used to synchronize data transfers within the DRAM module.

9. What does "CS#" do in the "MT41K256M16HA-125:E"?

Answer: The CS# pin is used to select the memory chip for operation, enabling or disabling it during read/write operations.

10. Can the "MT41K256M16HA-125:E" be used in desktop computers?

Answer: Yes, this chip is compatible with systems that support DDR4 memory, which includes most modern desktop computers.

11. What is the role of the CAS Latency in the "MT41K256M16HA-125:E"?

Answer: CAS Latency determines the delay between issuing a read command and the data becoming available. It is controlled through the CAS Latency Select pin (CASC#).

12. What are the BA pins used for in the "MT41K256M16HA-125:E"?

Answer: The BA pins select the specific bank within the DRAM module for a read or write operation.

13. What are DQ pins?

Answer: DQ pins are the data pins used to transfer data between the memory module and the system.

14. What does the RESET# pin do?

Answer: The RESET# pin is used to initialize or reset the DRAM device to its default state.

15. What is the function of the ODT pins in the "MT41K256M16HA-125:E"?

Answer: The ODT pins are used for on-die termination, improving signal integrity by controlling the impedance of the data bus during operation.

16. What happens if I connect the VSS pin incorrectly?

Answer: Incorrectly connecting the VSS (ground) pin can cause malfunctioning of the DRAM chip, possibly resulting in failure to initialize or data corruption.

17. Is the "MT41K256M16HA-125:E" compatible with other memory types like DDR3?

Answer: No, the "MT41K256M16HA-125:E" is a DDR4 chip, and DDR4 is not directly compatible with DDR3 due to differences in signaling, voltage, and speed.

18. How does the "MT41K256M16HA-125:E" handle power management?

Answer: The "MT41K256M16HA-125:E" includes power-saving features such as self-refresh mode and low power states to reduce power consumption when not actively in use.

19. Can the "MT41K256M16HA-125:E" be used in mobile devices?

Answer: The "MT41K256M16HA-125:E" is generally used in desktop and server environments, but with proper configurations, it could be integrated into mobile systems.

20. How is the DRAM timing for the "MT41K256M16HA-125:E" configured?

Answer: DRAM timing for this chip is configured by the system during initialization, using signals like CAS Latency, RAS to CAS delay, and others, which can be adjusted based on the application.

For a complete list of pins and their respective functions, it is crucial to consult the official datasheet or reference manual provided by Micron. The above answers provide a general overview based on common DDR4 features and specifications.